Substrate bonding machine for liquid crystal display device

ABSTRACT

A substrate bonding device for fabricating a liquid crystal display (LCD) device accurately aligns substrates of the LCD device while preventing the introduction of foreign material into the substrate bonding device, thereby substantially preventing the generation of defects within liquid crystal material of the LCD device.

[0001] This application claims the benefit of the Korean ApplicationNos. P2002-71366, P2002-71368, and P2002-71370, each filed on Nov. 16,2002, and P2002-71714, filed on Nov. 18, 2002, which is herebyincorporated by reference for all purposes as if fully set forth herein.This application incorporates by reference two co-pending applications,Ser. No. 10/184,096, filed on Jun. 28, 2002, entitled “SYSTEM AND METHODFOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICES” (Attorney DocketNumber 8733.666.00) and Ser. No. 10/184,088, filed on Jun. 28, 2002,entitled “SYSTEM FOR FABRICATING LIQUID CRYSTAL DISPLAY AND METHOD OFFABRICATING LIQUID CRYSTAL DISPLAY USING THE SAME” (Attorney DocketNumber 8733.684.00), as if fully set forth herein.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to liquid crystal display (LCD)devices, and more particularly to a substrate bonding devicefacilitating the fabrication of large-sized LCD devices.

[0004] 2. Background of the Related Art

[0005] With the expansion of the information society, a need has arisenfor displays capable of producing high quality images in thin,lightweight packages and that consume little power. To meet such needs,research has produced a variety of flat panel display devices, includingliquid crystal displays (LCD), plasma displays (PDP), electroluminescent displays (ELD), and vacuum fluorescent displays (VFD). Someof these display technologies have already been applied in various typesof displays.

[0006] Of the various types of flat panel display devices, LCD devices,having excellent display quality, light weight, thin dimensions, andconsuming low amounts of power, have been very widely used. In fact, inportable devices, such as notebook PC computers, LCD technology hasalready replaced cathode ray tubes (CRT) as the display of choice.Moreover, even in desktop PCs and in TV monitors, LCDs devices arebecoming more common.

[0007] Despite various technical developments in LCD technology,however, research in enhancing the picture quality of LCD devices hasbeen lacking compared to research in other features and advantages ofLCD devices. Therefore, to increase the use of LCD devices as displaysin various fields of application, LCD devices capable of expressing highquality images (e.g., images having a high resolution and a highluminance) with large-sized screens, while still maintaining a lightweight, minimal dimensions, and low power consumption must be developed.

[0008] LCDs are generally fabricated by coating a patterned sealantmaterial onto one of two substrates, providing the patterned sealantmaterial with an injection hole, bonding the two substrates together ina vacuum, and injecting liquid crystal material through the injectionhole and into a space between the two bonded substrates. It has alsobeen suggested that the liquid crystal material may be provided to LCDsvia a dispensing method, rather than an injection method. For example,Japanese Laid Open Patent Nos. 2000-284295 and 2001-005405 can beunderstood to disclose a method of dispensing liquid crystal materialwherein, after liquid crystal material is dispensed and sealant materialis coated onto one of the two substrates, the other of the twosubstrates is bonded to the one substrate in a vacuum.

[0009] Generally, liquid crystal material dispensing methods areadvantageous over liquid crystal material injection methods because theyreduce the number of fabrication steps required to fabricate LCD panels(e.g., formation of the liquid crystal injection hole, injection of theliquid crystal material, sealing of the liquid crystal injection hole,etc., are omitted), thereby simplifying fabrication of LCD panels.Accordingly, fabricating LCD panels by dispensing liquid crystalmaterial have been the subject of recent research.

[0010]FIGS. 1 and 2 illustrate a related art substrate bonding deviceused in fabricating LCD panels formed with dispensed liquid crystalmaterial.

[0011] Referring to FIGS. 1 and 2, the related art LCD device substratebonding device is provided with a frame 10, an upper stage 21, a lowerstage 22, a sealant dispensing part (not shown), a liquid crystalmaterial dispensing part 30, an upper chamber unit 31, a lower chamberunit 32, chamber moving means, and stage moving means.

[0012] The sealant dispensing part (not shown) and liquid crystaldispensing part 30 are typically provided at a side portion of the frame10. Moreover, the upper and lower chamber units 31 and 32, respectively,can be joined to each other to bond substrates of an LCD panel.

[0013] The chamber moving means generally includes a driving motor 40for moving the lower chamber unit 32 laterally to predeterminedpositions where the substrates are to be bonded (S2) and where thesealant material is to be coated and where the liquid crystal materialis to be dispensed (S1). The stage moving means includes a driving motor50 for raising and lowering the upper stage 21 to predeterminedpositions.

[0014] A method for fabricating an LCD panel using the related artsubstrate bonding device will now be described in greater detail.

[0015] A first substrate 51 is positioned on the lower stage 22 of thelower chamber unit 32 and the chamber moving means 40 moves the lowerchamber unit 32 under the upper chamber unit 31 such that the lowerstage 22 is beneath the upper stage 21. Next, the driving motor 50 ofthe stage moving means lowers the upper stage 21 to a predeterminedposition such that the first substrate 51 is secured to the loweredupper stage 21. Subsequently, the upper stage 21, to which the firstsubstrate 51 is secured, is raised to a predetermined position. Thechamber moving means 40 then moves the lower chamber unit 32 to aposition where a second substrate 52 is loaded on the lower stage 22.Subsequently, the chamber moving means 40 moves the lower chamber unit32 to a first predetermined position S1 (as shown in FIG. 1). At thefirst predetermined position S1, sealant material coating and liquidcrystal material dispensing processes are applied to the secondsubstrate 52 using the sealant dispensing part (not shown) and theliquid crystal dispensing part 30, respectively. After the coating thesealant material and dispensing the liquid crystal material, the chambermoving means 40 moves the lower chamber unit 32 to a secondpredetermined position S2 (as shown in FIG. 2) where the first andsecond substrates 51 and 52, respectively, can be bonded together. Next,the upper and lower chamber units 31 and 32, respectively, are joined toeach other such that the upper and lower stages 21 and 22, respectively,are arranged within an enclosed space. A vacuum is then created withinthe enclosed space using an evacuating means (not shown). After thevacuum is created, the stage moving means 50 lowers the upper stage 21such that the first substrate 51, secured to the upper stage 21,contacts the second substrate 52 on the lower stage 22. The upper stage21 is lowered until the two substrates become bonded, thereby completingthe fabrication of the LCD panel.

[0016] Use of the aforementioned related art substrate LCD devicesubstrate bonding device is disadvantageous, however, because theoverall size of the aforementioned related art substrate bonding deviceis excessively large, especially when designed to fabricate large-sizedLCD panels. The excessively large overall size of the related substratebonding device creates problems when designing LCD device fabricationprocesses because an adequate amount of space must be provided toinstall the related art substrate bonding device while preserving thespace in which other apparatuses of other processes are located.

[0017] Further, while the related art bonding device applies sealant andliquid crystal material to substrates supporting thin film transistorsand color filter layers and bonds the two substrates together, therelated art bonding device may increases the overall amount of timerequired to fabricate one LCD panel. More specifically, because liquidcrystal material is dispensed, sealant material is coated, andsubstrates are bonded all using the same apparatus, substratestransported from preceding processes must stand idle until the processesperformed by the related art substrate bonding device are complete.Moreover, the overall productivity of the LCD fabrication process isreduced since the related art substrate bonding device cannot processmaterial transported thereto while other fabrication processes are inprogress.

[0018] Still further, an imperfect seal can be formed between the joinedupper and lower chamber units 31 and 32, respectively. As a result, airmay leak from the external environment into the enclosed space definedby the upper and lower chamber units and the substrates may becomedamaged during bonding, thereby creating a defective bond.

[0019] Moreover, a substantially high degree of alignment is required toposition the lower chamber unit 32 and successfully bond the twosubstrates. Such alignment can be extremely difficult and complicatedand unduly lengthen the entire process of fabricating the LCD panel.Accordingly, the many positions the lower chamber 32 is required to moveto (e.g., the first position S1 for dispensing the liquid crystal andcoating the sealant material onto the second substrate 52, the secondposition S2 for bonding the two substrates, etc.) prevent the substratesfrom being properly aligned for a successful bonding.

[0020] Additionally, when loading and unloading substrates through theportion of the substrate bonding device, unbonded substrates cannot beloaded until the bonded substrates are unloaded. Accordingly, abottleneck is often generated in the LCD fabrication line and asubstantially continuous process is cannot be established. Accordingly,the overall amount of time required to fabricate and LCD device isincreased.

[0021] Further, static electricity is generated between variouscomponents and foreign materials introduced during the loading of thesubstrates to their respective stages. Such static electricity damagesthe substrates, necessitates frequent cleaning of the stages, andresults in a poor yield of the fabrication process.

SUMMARY OF THE INVENTION

[0022] Accordingly, the present invention is directed to a substratebonding device for a liquid crystal display device that substantiallyobviates one or more of the problems due to limitations anddisadvantages of the related art.

[0023] An advantage of the present invention provides a substratebonding device for use in fabricating an LCD device that can reduce theoverall time required to fabricate LCDs while enabling accurate andsimple alignment of substrates.

[0024] Another advantage of the present invention provides a substratebonding device for use in fabricating an LCD device that enables easymonitoring of a substrate bonding process and a progression ofcontinuous substrate bonding.

[0025] Yet another advantage of the present invention provides asubstrate bonding device for use in fabricating an LCD device thatsubstantially prevents the introduction of foreign material into aregion of the substrate bonding device where the substrates are bondedtogether, prevents generation of static electricity around thesubstrates, and promotes smooth bonding processes.

[0026] Still another advantage of the present invention provides asubstrate bonding device for use in fabricating an LCD device that cansubstantially prevent fine particles from sticking to surfaces of thestages and that can substantially prevent the generation of defectswithin the LCD caused by foreign material introduced during a substratebonding process.

[0027] Additional features and advantages of the invention will be setforth in the description which follows, and in part will be apparentfrom the description, or may be learned by practice of the invention.These and other advantages of the invention will be realized andattained by the structure particularly pointed out in the writtendescription and claims hereof as well as the appended drawings.

[0028] To achieve these and other advantages and in accordance with thepurpose of the present invention, as embodied and broadly described, asubstrate bonding device may, for example, include a base frame forproviding an outer appearance; a lower chamber unit mounted to the baseframe; an upper chamber unit positioned over the lower chamber unit andjoinable to the lower chamber unit; chamber moving means mounted to thebase frame for raising and lowering the upper chamber unit; an upperstage and a lower stage provided within interior spaces of the upper andlower chamber units, respectively, for securing a first substrate and asecond substrate, respectively; alignment cameras provided to at leastone of the upper and lower chamber units for verifying an alignmentstate of alignment marks formed on the first and second substrates; andalignment means provided to side surfaces of the lower chamber unit foradjusting relative positions of the first and second substrates.

[0029] In another aspect of the present invention, a substrate bondingdevice may, for example, include a base frame for providing an outerappearance; a lower chamber unit mounted to the base frame; an upperchamber unit positioned over the lower chamber unit and joinable to thelower chamber unit; chamber moving means mounted to the base frame forraising and lowering the upper chamber unit; an upper stage and a lowerstage provided within interior spaces of the upper and lower chamberunits, respectively, for securing a first substrate and a secondsubstrate, respectively; sealing means provided to at least one surfaceof the upper and lower chamber units; and a case for enclosing the upperand lower chamber units, the case having an side portion, wherein anopening is provided in the side portion, through which the substratesmay be inserted.

[0030] In a further aspect of the present invention, a substrate bondingdevice may, for example, include a base frame for providing an outerappearance; a lower chamber unit mounted to the base frame; an upperchamber unit positioned over the lower chamber unit and joinable to thelower chamber unit; chamber moving means mounted to the base frame forraising and lowering the upper chamber unit; an upper stage and a lowerstage provided within interior spaces of the upper and lower chamberunits, respectively, for securing a first substrate and a secondsubstrate, respectively; spraying means provided along side portions ofone of the upper and lower chamber units for spraying gas (e.g.,nitrogen, air, etc.) toward sides of the other of the upper and lowerchamber units; blowing means for blowing gas through the spraying means;and a first flow tube having a first end in communication with thespraying means and a second end in communication with the blowing means.

[0031] In still a further aspect of the present invention, a method ofprotecting stages in a substrate bonding device may, for example,include positioning a protection sheet over a surface of one of an upperand lower stage; verifying a time during which the protection sheet isreplaced; and rotating first and second reels when the time forreplacing the protection sheet is determined, wherein a used protectionsheet is wound over the first reel and an unused protection sheet iswound off the second reel and over the surface of the one of the upperand lower stage.

[0032] It is to be understood that both the foregoing generaldescription and the following detailed description are exemplary andexplanatory and are intended to provide further explanation of theinvention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings, which are included to provide afurther understanding of the invention and are incorporated in andconstitute a part of this specification, illustrate embodiments of theinvention and together with the description serve to explain theprinciples of the invention.

[0034] In the drawings:

[0035]FIGS. 1 and 2 illustrate a related art substrate bonding devicefor use in fabricating LCD panels formed via liquid crystal materialdispensing methods;

[0036]FIG. 3 illustrates a substrate bonding device for fabricating LCDpanels in accordance with a first aspect of the present invention in anunloaded state;

[0037]FIGS. 4A and 4B illustrate the interior structures of stageswithin the substrate bonding device in accordance with the first aspectof the present invention;

[0038]FIG. 5 illustrates a plan view of an arrangement of rotatable camswithin the substrate bonding device in accordance with the first aspectof the present invention;

[0039]FIG. 6 illustrates a perspective view of support means within thesubstrate bonding device in accordance with the first aspect of thepresent invention;

[0040]FIG. 7 schematically illustrates vacuum pumps and pipelines withinthe substrate bonding device in accordance with the first aspect of thepresent invention;

[0041]FIG. 8 illustrates the loading of a first substrate within thesubstrate bonding device in accordance with the first aspect of thepresent invention;

[0042]FIGS. 9 and 10 illustrate the securing of a first substrate to anupper stage within the substrate bonding device in accordance with thefirst aspect of the present invention;

[0043] FIGS. 11 to 13 illustrate the loading of a second substrate andthe securing of the second substrate to a lower stage within thesubstrate bonding device in accordance with the first aspect of thepresent invention;

[0044]FIGS. 14, 15A, and 15B illustrate a bonding of the substrateswithin the substrate bonding device in accordance with the first aspectof the present invention;

[0045] FIGS. 16 to 18 illustrate the alignment of the first and secondsubstrates using the alignment means in accordance with a firstpreferred embodiment of the present invention, schematically;

[0046]FIGS. 19A and 19B illustrate the venting process within thesubstrate bonding device in accordance with the first aspect of thepresent invention;

[0047]FIG. 20 illustrates a substrate bonding device for fabricating LCDpanels in accordance with a second aspect of the present invention in anunloaded state;

[0048]FIG. 21 illustrates the simultaneous loading of unbondedsubstrates into, and unloading of bonded substrates out of the substratebonding device in accordance with the second aspect of the presentinvention;

[0049]FIG. 22 illustrates a substrate bonding device for fabricating LCDpanels in accordance with a third aspect of the present invention in anunloaded state;

[0050]FIG. 23 illustrates a perspective view of spraying means withinthe substrate bonding device in accordance with the third aspect of thepresent invention;

[0051]FIG. 24 illustrates a substrate bonding device for fabricating LCDpanels in accordance with a fourth aspect of the present invention in anunloaded state;

[0052] FIGS. 25 to 29 illustrate the process of bonding substrates usingthe substrate bonding device in accordance with the fourth aspect of thepresent invention;

[0053]FIGS. 30 and 31 illustrate key parts showing a process forpositioning a protection sheet within the substrate bonding device inaccordance with the fourth aspect of the present invention;

[0054]FIG. 32 illustrates the principles of the third aspect of thepresent invention applied to the substrate bonding device in accordancewith the second aspect of the present invention;

[0055]FIG. 33 illustrates the principles of the fourth aspect of thepresent invention applied to the substrate bonding device in accordancewith the second aspect of the present invention;

[0056]FIG. 34 illustrates the principles of the third and fourth aspectsof the present invention applied to the substrate bonding device inaccordance with the second aspect of the present invention; and

[0057]FIG. 35 illustrates the principles of the fourth aspect of thepresent invention applied to the substrate bonding device in accordancewith the third aspect of the present invention.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

[0058] Reference will now be made in detail to embodiments of thepresent invention, examples of which are illustrated in the accompanyingdrawings.

[0059]FIG. 3 illustrates a substrate bonding device for fabricating LCDpanels in accordance with a first aspect of the present invention in anunloaded state.

[0060] Referring to generally to FIG. 3, the substrate bonding device inaccordance with the principles of the first aspect of the presentinvention may, for example, include a base frame 100; an upper chamberunit 210; a lower chamber unit 220; chamber moving means (e.g., 310,320, 330, 340, and 350); an upper stage 230; and a lower stage 240;sealing means (e.g., 250); alignment cameras 520; alignment means (e.g.,531, 532, 533, 534, 540, and 541) shown, for example, in FIG. 5; supportmeans (e.g., 710 and 720), shown for example, in FIG. 6; vacuum pumpingmeans (e.g., 610, 621, and 622) shown, for example, in FIG. 7; andinterlocking means (e.g., 510).

[0061] In one aspect of the present invention, the base frame 100 may befixed to a supporting structure or surface (e.g., the ground), may formthe exterior appearance of the substrate bonding device, and may supportdifferent components discussed in greater detail below.

[0062] In another aspect of the present invention, upper and lowerstages 230 and 240 may be fixed to the upper chamber unit 210 and thelower chamber unit 220, respectively. As will be described in greaterdetail below, the upper and lower chamber units 210 and 220 may beselectively joined to each other to define an interior space.

[0063] The upper chamber unit 210 may, for example, include an upperbase 211 that may be exposed to an external environment and an upperchamber plate 212 immovably attached to a bottom surface of theperiphery of the upper base 211. In one aspect of the present invention,the upper chamber plate 212 may be provided as a rectangular rim anddefine an interior space within which the upper stage 230 is fixed.Since the upper stage 230 is fixed to the upper chamber unit 210, theupper stage may be raised and lowered with the upper chamber unit 210.In another aspect of the present invention, a first seal member 213 maybe arranged between the upper base 211 and the upper chamber plate 212of the upper chamber unit 210 to seal the interior space defined by theupper chamber plate 212 from the external environment. In one aspect ofthe present invention, the first seal member 213 may be provided as agasket, an o-ring, or the like, suitable for sealing.

[0064] The lower chamber unit 220 may, for example, include a lower base221 fixed to the base frame 100 and a lower chamber plate 222 arrangedabove a top surface of the periphery of the lower base 221. In oneaspect of the present invention, the lower chamber plate 222 maybeprovided as a rectangular rim and define an interior space within thewhich the lower stage 240 is fixed. In another aspect of the presentinvention the lower chamber plate 222 may be movable in left, right,forward, and backward (i.e., lateral) directions with respect to thelower base 221. In another aspect of the present invention, the lowerchamber unit 220 may include a fixing plate 223 for fixing the lowerbase 221 to the base frame 100. In yet another aspect of the presentinvention, a second seal member 224 may be arranged between the lowerbase 221 and the lower chamber plate 222 of the lower chamber unit 220and may seal the interior space defined by the lower chamber plate 222from a the external environment. In one aspect of the present invention,the second seal member 224 may be provided as a gasket, an O-ring, orthe like, suitable for sealing.

[0065] According to the principles of the present invention, at leastone support part 225 may be arranged between the lower base 221 and thelower chamber plate 222 for maintaining the lower chamber plate 222 apredetermined a distance from the upper surface of the lower base 221.The support part 225 may include a first end attached to a bottomportion of the lower chamber plate 222 and a second end that is movablein lateral directions with respect to the lower base 221 and is attachedto a piece that is attached to a bottom portion of the lower base 221.Accordingly, the support part 225 enables the lower chamber plate 222 tomove in left, right, forward, and backward directions relative to thelower base 221.

[0066] Referring still to FIG. 3, the aforementioned chamber movingmeans may, for example, include a driving motor 310 fixed to the baseframe 100, a driving shaft 320 coupled to the driving motor 310, aconnecting shaft 330 arranged substantially perpendicular to the drivingshaft 320 for receiving a driving force from the driving shaft 320, aconnecting part 340 for connecting the driving shaft 320 to theconnecting shaft 330, and a jack part 350 mounted at an end of theconnecting shaft 330.

[0067] In one aspect of the present invention, the driving motor 310 maybe arranged within an interior bottom portion of the base frame 100 andmay be provided as a bilateral shaft motor, having shafts horizontallyprojecting from both sides of the driving motor 310. The driving shaft320 may be connected to the driving motor 310 and transmit drivingforces along a horizontal direction to the connecting part 340 while theconnecting shaft 330 may be connected to the connecting part 340 totransmit the driving force along a vertical direction with respect tothe driving shaft 320. The jack part 350 may be provided at the end ofthe connecting shaft 330, may be connected to the upper chamber unit210, and may include a nut housing to move the upper chamber unit 210upwardly and downwardly, depending on a rotation direction of rotationof the connecting shaft 330. The connecting part 340 may be provided asa system of bevel gears to translate a rotational force supplied fromthe driving shaft 320 along a horizontal direction into a verticalrotational force to the connecting shaft 330.

[0068] According to the principles of the present invention, the upperand lower stages 230 and 240, respectively, may each include a fixingplate 231 and 241, respectively, fixed to a respective one of the upperchamber unit 210 and the lower chamber unit 220; a securing plate 232and 242, respectively, for securing the first and second substrates; anda plurality of fixing blocks 233 and 243, respectively, arranged betweenrespective pairs of the fixing plates 231 and 241 and the securingplates 232 and 242. In one aspect of the present invention, the securingplates 232 and 242 may each be provided as an electrostatic chuck (ESC)formed of a material such as polyimide for securing a substrate to arespective one of the stages by applying an electrostatic charge.

[0069]FIGS. 4A and 4B illustrate the interior structures of stageswithin the substrate bonding device in accordance with the principles ofthe present invention.

[0070]FIGS. 4A and 4B illustrate enlarged sectional views of “A” and “B”regions, respectively, shown in FIG. 3. Accordingly, and while referringto FIGS. 4A and 4B, each of the securing plates 232 and 242 may, forexample, additionally include a plurality of holes 232 a and 242 a,respectively, for transmitting a suction force to secure respective onesof the substrates. Accordingly, each of the plurality of holes 232 a and242 a may be in communication with a respective one of a vacuum pipeline271 and 272, respectively, formed within a respective one of the upperstage 230 and lower stage 240. In one aspect of the present invention,each vacuum pipeline 271 and 272 may be connected to a vacuum pump means(e.g., 622, as shown in FIG. 7) for generating the suction force.

[0071] Referring back to FIG. 3, the sealing means 250 (hereinafterreferred to as a third seal member) may be provided as an O-ring, formedof a material such as rubber, and fitted along a top surface of thelower chamber plate 222 of the lower chamber unit 220. In one aspect ofthe present invention, the third seal member 250 may project from thetop surface of the lower chamber plate 222 to a predetermined height andbe formed to a predetermined thickness sufficient to prevent substrates,secured by respective ones of the upper and lower stages 230 and 240,from becoming proximately arranged next to each other upon initiallyjoining the upper and lower chamber units 210 and 220, as will bediscussed in greater detail below. In another aspect of the presentinvention, the thickness of the third seal member 250 may be sufficientto permit the substrates to contact each other when the third sealmember 250 is compressed.

[0072] According to the principles of the present invention, theaforementioned alignment means may be used to align substrates 110 and120 secured to upper and lower stages 230 and 240, respectively. In oneaspect of the present invention, the alignment means may be coupled tothe lower chamber unit 220 and, during alignment of the substrates 110and 120, the lower stage 240 may be kept substantially stationary whilethe position of the upper stage 230 is adjusted in accordance with theposition of the lower chamber plate 222, adjustable with the alignmentmeans. In one aspect of the present invention, the alignment means may,for example, include a plurality of cams 531, 532, 533, and 534 and stepmotors 540 connected to shafts 541 for driving the cams 531, 532, 533,and 534.

[0073]FIG. 5 illustrates a plan view of an arrangement of the rotatablecams in the substrate bonding device in accordance with the principlesof the present invention.

[0074] Referring to FIGS. 3 and 5, each of the cams 531, 532, 533, and534 may be rotatably arranged to selectively contact a peripheralsurface of the lower chamber plate 222. In one aspect of the presentinvention, the cams 531, 532,533, and 534 may be arranged substantiallysymmetrically along each of the peripheral surfaces of the lower chamberplate 222. In another aspect of the present invention, each of the camsmay be eccentrically rotatable such that, upon rotating, the lowerchamber plate 222 may be pushed in a predetermined direction. Inaccordance with the principles of the present invention, the lowerchamber unit may be defined by four sides, wherein a first pair ofopposing sides may be longer than a second pair of opposing sides.Accordingly, two cams may be rotatably arranged to selectively contacteach side of the first pair of opposing sides and one cam may bearranged to selectively contact a middle portion of each side of thesecond pair of opposing sides such that the lower chamber plate 222 maybe movable in the left, right, forward, and backward directions. In oneaspect of the present invention, each of the cams 531 532, 533, and 534may rotate substantially in unison to push the lower chamber plate 222along a predetermined direction. For example, if first cams 531 arerotated to push the lower chamber plate 222 along a predetermineddirection, the second cams 532, arranged opposite the first cams 531,and the third and fourth cams 533 and 534, respectively, arrangedadjacent the first cams 531, may all rotate substantially in unison suchthat the lower chamber plate 222 is pushed along the predetermineddirection. According to the principles of the present invention, adistance between surfaces of oppositely arranged cams (e.g., 531 and 532or 533 and 534) may remain substantially constant (e.g., the length orwidth of the lower chamber plate 222).

[0075] According to the principles of the present invention, theinterlocking means 510 may, for example, includes a plurality of holes222 a provided in the lower chamber plates 222 of the lower chamber unit220, and a plurality of linear actuators 511 fixed along a periphery ofthe upper chamber unit 210 for lowering corresponding ones of theplurality of movable shafts 512 until the movable shafts 512 arereceived within respective ones of the holes 222 a.

[0076]FIG. 6 illustrates a perspective view of support means within thesubstrate bonding device in accordance with the first aspect of thepresent invention.

[0077] Referring to FIGS. 3 and 6, the support means may, for example,include a lift pin 710 and a plurality of actuators 720. In one aspectof the present invention, the lift pin 710 may have a thicknesssufficient to support at least one substrate while substantiallypreventing the at least one substrate from sagging. A central region ofthe lift pin 710 may include a downwardly bent portion for allowing aloader 910 to support the at least one substrate without interferingwith the lift pin 710. Moreover, portions of the lift pin 710 may beraised through the lower stage 240 and above the upper surface of thelower stage 240 to facilitate the safe seating of the substrate 120 asit is loaded onto the lower stage 240. In one aspect of the presentinvention, when a substrate is not loaded onto the lower stage 240, atop surface of the lift pin 710 may be positioned below the top surfaceof the lower stage 240. In another aspect of the present invention, aplurality of actuators 720 may raise and lower the lift pin 710 asrequired. Accordingly, the support means may facilitate the unloading ofthe bonded and unbonded substrates seated on the lower stage 240 (see,for example FIG. 21).

[0078]FIG. 7 schematically illustrates vacuum pumps and pipelines withinthe substrate bonding device in accordance with the first aspect of thepresent invention.

[0079] Referring to FIGS. 3 and 7, the aforementioned vacuum pumpingmeans 610, 621, and 622 may be provided to at least one of the upper andlower chamber units 210 and 220 and may evacuate the sealed interiorspace defined by the upper and lower chamber units 210 and 220 joinedtogether. In one aspect of the present invention, the vacuum pumpingmeans 610, 621, and 622 may, for example, include a high vacuum pump(Turbo Molecular Pump, “TMP”) 610 and a first and second low vacuum pump(Dry-Pump) 621 and 622, respectively.

[0080] The first low vacuum pump 621 may be connected to a high vacuumchamber pipeline 630 provided at a central region of the upper chamberunit 210 and enable the high vacuum pump 610 and the interior spacesdefined by the upper and lower chamber plates 212 and 222 to be incommunication with each other. Moreover, the first low vacuum pump mayevacuate the sealed interior space, definable by the upper and lowerchamber units 210 and 220 to a predetermined pressure.

[0081] The second low vacuum pump 622 may be connected to low vacuumchamber pipelines 641 and 642 passing through side regions of the upperand lower chamber units 210 and 220. Further, the second low vacuum pump622 may be connected to pipelines in the upper and lower stages 230 and240 and to a substrate securing pipeline 650 connected to the vacuumpipelines 271 and 272 in the stages 230 and 240, respectively, forsecuring the substrates using a suction force. The pipelines 630, 641,642, and 650 may include at least one shut off valve 661, 662, 663, 664,665, 666, 667, 668, and 669. The high pressure vacuum pipeline 630 mayinclude a pressure sensor 670 for measuring a pressure inside of theinterior spaces the substrates are held therein.

[0082] As will be discussed in greater detail below, the low vacuumchamber pipelines 641 and 642 and the substrate securing pipeline 650,in communication with the second low vacuum pump 622, may be used aspipelines for venting. Accordingly, a gas such as nitrogen (N₂) may beinjected into the sealed interior space definable by the upper and lowerchamber units 210 and 220 for returning a pressure therein from a vacuumstate to an atmospheric pressure.

[0083] Referring back to FIG. 3, a plurality of alignment cameras 520may be mounted within at least one of the upper and lower chamber units210 and 220, respectively, such that alignment marks (not shown) formedon the substrates (not shown), secured by the upper or lower stages 230or 240, may be observed through at least one of the upper chamber unit210 and the lower chamber unit 220.

[0084] A method for fabricating an LCD device using the substratebonding device shown in FIGS. 3 to 7 will now be described in greaterdetail with reference to FIGS. 8 to 19B.

[0085] The substrate bonding device may first be provided in theunloaded state as shown in FIG. 3. Subsequently, a first substrate 110may be brought into a space between the upper and lower chamber units210 and 220, respectively, via a loader 910.

[0086] Next, and while referring to FIG. 9, the upper chamber unit 210may be lowered from its original position such that the upper stage 230is arranged proximate the first substrate 110. The first substrate 110may then become secured to the upper stage 230 by a suction forcegenerated by the second low vacuum pump 622 and by an electrostaticcharge (ESC) generated by the securing plate 232.

[0087] Referring now to FIG. 10, after the first substrate 110 has beensecured to the upper stage 230, the upper chamber unit 210 may be raisedto its original position and the loader 910 may be removed from thesubstrate bonding device.

[0088] Next, and with reference to FIG. 11, the loader 910 may bere-inserted inserted into the substrate bonding device while supportingthe second substrate 120. Upon loading the second substrate 120 into thesubstrate bonding device, the lift pin 710 may be raised from itsoriginal position, through the lower stage 230 and from below the uppersurface of the lower stage 230, to push the second substrate 120 awayfrom the loader 910. Accordingly, the lift pin 710 may support thesecond substrate 210 at a predetermined height above the loader 910 (asshown in FIG. 12). When the second substrate 120 is supported at thepredetermined height, the loader 910 may be removed from the substratebonding device. Next, the lift pin 710 may be lowered such that thesecond substrate 120 rests on, and is supported by, the lower stage 240.When the second substrate 120 is supported by the lower stage 240, thesecond substrate 120 may be secured to the lower stage 240 using suctionforces and electrostatic charges. When the first and second substrates110 and 120 are secured to their respective stages 230 and 240, loadingof the substrate bonding device is complete.

[0089] Referring now to FIG. 13, after loading of the substrate bondingdevice is complete, the driving motor 310 of the chamber moving meansmay rotate the driving shafts 320 and the connecting shafts 330 to lowerthe jack parts 350 from their original positions. In one aspect of thepresent invention, the upper chamber unit 210 is lowered as the jackparts 350 are lowered from their original positions. Further, the linearactuators 511 may lower the plurality of movable shafts 512 such thatthe moveable shafts 512 project to a predetermined height from thebottom surface of the upper chamber plate 212.

[0090] Referring to FIG. 14, as a result of the lowering of the upperchamber unit 210 and of the projection of the moveable shafts 511, theend portions of the moveable shafts 512 may be received within, andcontact interior surfaces of respective ones of the holes 222 a formedin the lower chamber plate 222. In the event that, for example, theupper chamber unit 210 is not substantially level with respect to thelower chamber unit 220, the movable shafts 511 may contact the interiorsurfaces of the holes 222 a in succession. As the end portions of themoveable shafts 511 are received within the holes 222 a, the chambermoving means moves the upper chamber unit 210 downwardly such that abottom surface of the upper chamber plate 212 contacts a top surface ofthe third sealing member 250, fitted to a periphery of the lower chamberplate 222.

[0091] Referring now to FIG. 16, as the jack parts 350 are loweredfurther, they move out from between the upper chamber unit 210 the lowerchamber unit 220 such that a sealed interior space, defined by the upperand lower chamber units 210 and 220 is created, wherein the sealedinterior space is substantially sealed from the external environment dueto the weight of the upper chamber unit 210 pressing upon the third sealmember 250. Therefore, the first and second substrates 110 and 120 maybe substantially isolated from the external environment.

[0092] It one aspect of the present invention the first and secondsubstrates 110 and 120, arranged within sealed interior spaced definedby the joined upper and lower chamber units, may be partially bonded toeach other but separated from each other by an initial distance of a fewhundred microns. By partially bonding, the relative positions of thefirst and second substrates 110 and 120 may be adjusted in a subsequentalignment process. After the alignment process is complete, thesubstrate may be bonded together in a subsequent venting process, aswill be discussed in greater detail below. In one aspect of the presentinvention, the distance between the upper chamber unit 210 and the lowerchamber unit 220 (and therefore the gap between the substrates) may bedetermined by the gap determining sensor 920.

[0093] Once created, the sealed interior space defined by the upper andlower chamber units 210 and 220 is evacuated. Accordingly, the first andsecond low vacuum pumps 621 and 622 may be activated to evacuate thesealed interior space to a first pressure, measured by the pressuresensor 670. After it is determined that the first and second low vacuumpumps 621 and 622 have evacuated the interior space to the firstpressure, the high vacuum pump 610 may be activated to substantiallyevacuate the interior space.

[0094] In one aspect of the present invention, the high and first lowvacuum pumps 610 and 621 may be connected to the same pipeline 630.Therefore, the first low vacuum pump 621 may be deactivated when thehigh vacuum pump 610 is activated. After the interior space issubstantially evacuated, the first and second substrates 110 and 120,arranged within the evacuated, sealed interior space may be aligned bythe alignment means and the alignment cameras 520.

[0095] According to the principles of the present invention, thealignment cameras 520 may observe alignment marks (not shown) formed onthe first and second substrates 110 and 120 and may verify positionaldeviations between the alignment marks on the substrates 110 and 120.The verified positional deviations may include distances the upper stageis required to move in order to be properly aligned. Accordingly, thedistances the upper stage 230 is required to move to be properly alignedmay be calculated with reference to the verified deviations.

[0096] According to the principles of the present invention, the lowerstage 240 is fixed to a top surface of the lower base 221. Accordingly,the position of the lower chamber plate 222 with respect to the lowerstage 240 may be adjusted. Since the upper stage 230 does not move withrespect to the upper chamber plate 210, the upper stage 230 moves insubstantial unison with the movement of the lower chamber plate 222 viathe interlocking means 510. Therefore, to adjust the alignment of thefirst and second substrates 110 and 120, fixed to their respectivestages 230 and 240, the motion of the lower chamber plate 222, generatedby the alignment means (e.g., rotation of the cams 531, 532, 533, and534 at the peripheral surfaces of the lower chamber plate 222), may betranslated through the interlocking means 510 to the upper stage 230,fixed to the upper chamber unit 210.

[0097] In one aspect of the present invention, the degree and directionthe cams rotate may be based on the calculated distance the upper stageis required to move to be properly aligned. Accordingly, step motors540, eccentrically fixed the cams via cam shafts 541, may rotate thecams as required. According to the principles of the present invention,the cams 531, 532, 533, and 534 may be rotatably arranged to selectivelycontact a peripheral surface of the lower chamber plate 222.

[0098] Referring now to FIG. 17, upon verifying a positional deviationbetween the first and second substrates 110 and 120 using the alignmentcameras 520, it may determined, for example, that the first substrate110 has a 2 mm deviation in a rear direction and 2 mm deviation in aleft direction with respect to the second substrate 120, the upperchamber unit 210, having the upper stage 230 fixed thereto, may then bemoved by 2 mm in a front direction and 2 mm in a right direction usingthe aforementioned alignment means. Accordingly, the first and secondsubstrates may be accurately aligned while they are secured by theirrespective stages 230 and 240.

[0099] With reference to FIG. 18, the aforementioned exemplarypositional deviation may be corrected by eccentrically rotating the cams531, 532, 533, and 534 contacting the lower chamber plate 222 to apredetermined degree and in a predetermined manner. For example, thefirst cams 531, arranged at a rear peripheral surface of the lowerchamber plate 222 may be eccentrically rotated such that lower chamberplate is moved forward while the second cams 532, arranged at a frontperipheral surface of the lower chamber plate 222, are eccentricallyrotated such that the second cams 532 and the front peripheral surfaceof the lower chamber plate 222 are separated by a predetermineddistance. Further, the third cam 533, arranged at the left peripheralsurface of the lower chamber plate 222, may be eccentrically rotatedsuch that the lower chamber plate 222 is moved to the right while thefourth cam 534, arranged at the right peripheral surface of the lowerchamber plate 222, is eccentrically rotated such that the fourth cam andthe right peripheral surface of the lower chamber plate are separated bya predetermined distance. It is readily appreciated that the principlesof the present invention may be applied to correct substantially anypositional deviation between the substrates, wherein rotational amountsand directions of individual ones of the cams may be selectivelycontrolled to move the lower chamber plate 222 in front, rear, left, andright directions either consecutively or simultaneously (e.g., to movethe lower chamber plate 222 in diagonal directions).

[0100] According to the principles of the present invention, the motionimparted by alignment means to the lower chamber plate 222 is translatedthrough the interlocking means 510 to the upper chamber unit. After thepositional deviations have been corrected by the alignment means, thefirst and second substrates 110 and 120 are substantially aligned.Accordingly, the principles of the present invention provide the lowerchamber plate 222, the upper chamber unit 210, the upper stage 230, andthe upper substrate 110 to move substantially as a single body,independent of the lower stage 240. Therefore, a smooth and precisepositional alignment of the first and second substrates, secured bytheir respective stages 230 and 240, may be obtained.

[0101] According to the principles of the present invention, the firstand substrates 110 and 120 may be aligned more than once depending onthe type of alignment marks that are formed on the substrates. Forexample, if two types of alignment marks are formed on the first andsecond substrates (e.g., rough alignment marks and fine alignmentmarks), two alignment processes may need to be performed, wherein therough alignment marks are aligned in a rough alignment process beforethe fine alignment marks are aligned in a fine alignment process.

[0102] When the rough alignment process is performed, the firstsubstrate 110 may be spaced apart from the second substrate 120 byapproximately 500 μm to approximately 800 μm. In one aspect of thepresent invention, the first substrate 110 may be spaced apart from thesecond substrate 120 by approximately 650μm during the rough alignmentprocess, as shown in FIG. 15A. When the fine alignment process isperformed, the first substrate 110 may be spaced apart from the secondsubstrate 120 by approximately 100 μm to approximately 250 μm. In oneaspect of the present invention, the first substrate 110 may be spacedapart from the second substrate 120 by approximately 150 μm during thefine alignment process, as shown in FIG. 15B.

[0103]FIGS. 19A and 19B illustrate the venting process within thesubstrate bonding device in accordance with the first aspect of thepresent invention.

[0104]FIG. 19B illustrates an enlarged sectional view of the region “D”shown in FIG. 19A. Accordingly, and while referring now to FIGS. 19A and19B, after the first and second substrates 110 and 120 have beensubstantially aligned, a power applied to the upper stage 230 generatingthe electrostatic charge, may be turned off and the sealed interiorspace defined by the upper and lower chamber units, within which thealigned first and second substrates are arranged, may be vented.

[0105] According to the principles of the present invention, the ventingmay be performed by injecting a gas such as nitrogen (N₂) into thesealed interior space via the low vacuum pipelines 641 and 642 connectedto the second low vacuum pump 622 through the upper and lower stages 230and 240 to increase pressure within the sealed interior space to anatmospheric pressure. Due to the pressure of the injected gas blowing inthrough the upper stage 230, the first substrate 110, previously securedby the upper stage 230, moves away from the upper stage 230 and becomesbonded to the second substrate 120. As the venting progresses, thepressure within the sealed interior space increases while the pressurebetween the bonded substrates remains substantially in a vacuum state.Due to the difference in pressure between the interior of the bondedsubstrates and the pressure within the sealed interior space, the twosubstrates 110 and 120 may become fully bonded to each other and thedistance between the first and second substrates 110 and 120 decreases.

[0106] After the venting is complete, the bonded substrates 110 and 120may unloaded wherein, after the bonded substrates are unloaded, theaforementioned processes may be repeated to bond other substratestogether.

[0107] Side portions of substrate bonding device described above, withreference to the first aspect of the present invention, are open to theexternal environment. Therefore, foreign material may be unintentionallyand deleteriously introduced into the upper and lower stages 230 and 240and into a space between the first and second substrates. Such foreignmaterial may degrade the quality of the liquid crystal material.Accordingly, a substrate bonding device capable of preventing suchforeign material from being introduced may be beneficial.

[0108] Therefore, and in accordance with the principles of a secondaspect of the present invention, a substrate bonding device may beprovided wherein foreign material from the external environment issubstantially prevented from being introduced either on the stages, onthe substrates, or otherwise between the upper and lower chamber units.For example, the substrate bonding device of the second aspect of thepresent invention may be provided with a case for enclosing thesubstrate bonding device of the first aspect of the present inventionand sealing the substrate bonding device of the first aspect of thepresent invention from the external environment.

[0109]FIG. 20 illustrates a substrate bonding device for fabricating LCDpanels in accordance with the second aspect of the present invention inan unloaded state.

[0110] Referring to FIG. 20, side surfaces of the case 400 may beprovided with first and second openings 410 and 420, respectively,through which the first and substrates 110 and 120 may be loaded intoand unloaded from the substrate bonding machine. Further, the case 400may substantially enclose surroundings between the upper chamber unit210 and lower chamber unit 220 to substantially prevent foreign materialfrom being introduced between the chamber units 210 and 220.

[0111] In one aspect of the present invention, a portion of the case 400proximate the upper and lower chamber units 210 and 220 may be formedout of a transparent material to facilitate observing at least theprogression of the bonding of the substrates 110 and 120. In anotheraspect of the present invention, a portion of the case 400 proximate theupper and lower stages 230 and 240 may be formed out of a transparentmaterial. Accordingly, the portion of the case 400 formed out of thetransparent material may be provided as observation windows, or thelike. In yet another aspect of the present invention, the entire case400 may be formed of a transparent material. In one aspect of thepresent invention, the case 400 may be formed to enclose only a part ofthe upper and lower chamber units 210 and 220 (e.g., only an upper partof the base frame 100, as shown in FIG. 20) or may enclose substantiallythe entire substrate bonding device.

[0112] Referring to FIG. 21, by providing the first and second openings410 and 420, substrates may be loaded into and unloaded from thesubstrate bonding device substantially simultaneously. In one aspect ofthe present invention, the first opening 410 may be arranged within thecase 400 and opposite the second opening 420. In another aspect of thepresent invention, unbonded substrates (e.g., first or secondsubstrates) may be loaded into the substrate bonding device via thefirst opening 410. In yet another aspect of the present invention,bonded substrates may be unloaded from the substrate bonding device viathe second opening 420. In still another aspect of the presentinvention, a first loader 910 may load unbonded substrates into thesubstrate bonding device through the first opening 410. In yet anotheraspect of the present invention, a second loader 920, different from thefirst loader 910, may unload bonded substrates from the substratebonding device through the second opening 420.

[0113] According to the principles of the present invention, theopenings 410 and 420 may be provided with doors (not shown) for closingthe openings during progression of the aforementioned substrate bondingprocesses.

[0114] Accordingly, substrate bonding device of the second aspect of thepresent invention may advantageously prevent the introduction of foreignmaterial between the substrates while enabling the bonding process to beviewed.

[0115]FIG. 23 illustrates a perspective view of spraying means withinthe substrate bonding device in accordance with the third aspect of thepresent invention.

[0116] Referring to FIGS. 22 and 23, the substrate bonding device inaccordance with the principles of the third aspect of the presentinvention may be provided with the substrate bonding device of the firstaspect of the present invention and further include spraying means,blowing means, and a first flow passage 840 to substantially prevent theintroduction of foreign material.

[0117] In one aspect of the present invention, the spraying means may bemounted to the upper chamber unit 210 and may spray a gas such asnitrogen, air, or the like, to side portions of the lower chamber unit220. The spraying means may further include an ionizer for emitting ionsto side portions of the lower chamber unit 220. Accordingly, the ionsemitted by the ionizer may include ions generated from the sprayed gasand may substantially prevent the generation of unwanted staticelectricity within the substrate bonding device. Consequently, damage tothe substrates caused by static electricity may be substantiallyprevented using the ionizer.

[0118] According to the principles of the third aspect of the presentinvention, a peripheral portion of the lower chamber plate 222 may, forexample, include an outwardly sloped surface 226 for discharging gassprayed through first spraying holes 811 to outside the chamber units210 and 220. In one aspect of the present invention, the sloped surface226 may comprise a curved surface, sloping downward toward the edges ofthe lower chamber plate 222 such that the edges of the lower chamberplate 222 are thinner than interior regions of the lower chamber plate222. In another aspect of the present invention, the sloped surface 226may smoothly deflect the sprayed gas while minimizing the degree towhich the gas is turbulently deflected. The first flow tube 840 mayinclude a first end in communication with a second flow tube 810 and asecond end in communication with a fan 831.

[0119] In one aspect of the present invention, the blowing means mayinclude the fan 831 and a fan motor 832 for driving the fan 831.

[0120] According to the principles of the present invention, the ionizermay, for example, include a plurality of second spraying holes 812formed in side surfaces of the second flow tube 810 to direct gas towardthe stages 230 and 240 and an ion generating tip 820 arranged proximateeach of the second spraying holes 812. In one aspect of the presentinvention, the ionizer may be formed separately from the spraying means.

[0121] A process by which foreign material may be prevented from beingintroduced into the substrate bonding device of the third aspect of thepresent invention will now be described in greater detail below.

[0122] Using a controlling part (not shown), the fan motor 832 may beactivated after the aforementioned substrate bonding process has beeninitiated but prior to completion of the substrate bonding process(e.g., in the middle of the substrate bonding process). Accordingly, theactivated fan motor may rotate the fan 831 to thus blow the gas throughthe first flow tube 840. Next, the blown gas becomes introduced into thesecond flow tube 810 via the first flow tube 840, passes through thefirst spraying holes 811 in the second flow tube 810, and is sprayedtoward the sloped surface 226 of the lower chamber plate 222.Subsequently, the sprayed gas flows onto the sloped surface 226 andbecomes deflected and discharged outside the lower chamber unit 220 tothereby prevent the introduction of foreign material into a spacebetween the chamber units 210 and 220.

[0123] In one aspect of the present invention, the sprayed gas may beionized. Accordingly, ions from the sprayed gas may be arrangedproximate the stages 230 and 240 to substantially prevent staticelectricity from being generated during bonding of the substrates. Inone aspect of the present invention, the ions emitted from the iongenerating tips 820 and a portion of the gas in the second flow tube 810passing through the second spraying holes 812 may be arranged proximatethe stages 230 and 240. Accordingly, the generation of unwanted staticelectricity may be prevented proximate the stages 230 and 240 can beprevented by spraying the gas, including the ions, to the stages 230 and240.

[0124]FIG. 24 illustrates a substrate bonding device for fabricating LCDpanels in accordance with a fourth aspect of the present invention in anunloaded state. FIGS. 25 to 29 illustrate the process of bondingsubstrates using the substrate bonding device in accordance with thefourth aspect of the present invention. FIGS. 30 and 31 illustrate aprocess for positioning a protection sheet within the substrate bondingdevice in accordance with the fourth aspect of the present invention.

[0125] Referring to FIGS. 24 to 31, the substrate bonding device inaccordance with principles of the fourth aspect of the present inventionmay substantially prevent problems related to the introduction offoreign material accumulated on the stages. For example, when foreignmaterial accumulates on the stages, a positional variation on the orderof a few microns is generated. Such a positional variation impedesaccurate alignment of the substrates. Moreover the foreign material alsogenerates other defects within the LCD. Accordingly, the substratebonding device of the fourth aspect of the present invention may beprovided substantially as the aforementioned substrate bonding device ofthe first aspect, but may further include a first reel 851, a secondreel 852, a protection sheet 860, and a rotating part 870.

[0126] In one aspect of the present invention, the first and secondreels 851 and 852, respectively, may be arranged at opposite sideportions of the lower stage 240, fixed in the lower interior space ofthe lower chamber unit 220. In another aspect of the present invention,the first and second reels 851 and 852, respectively, may be arranged atopposite side portions of the upper stage 230. In yet another aspect ofthe present invention, the first and second reels 851 and 852,respectively, may be arranged at opposite side portions of both theupper and lower stages 230 and 240, respectively.

[0127] According to the principles of the present invention, theprotection sheet 860 may substantially cover a surface of the lowerstage 240 (or of the upper stage 230), wherein opposite ends of theprotection sheet may be wound around the first and second reels 851 and862 and wherein the protection sheet 860 may substantially prevent theaccumulation of foreign matters on the surface of the lower stage 240(or upper stage 230).

[0128] In one aspect of the present invention, the protection sheet 860may be formed of a material which can transmit an electrostatic chargegenerated by the securing plate 242 (or 232) to the substrates 110 and120 and may include openings corresponding to the plurality of holes 242a (or 232 a) formed in the lower stage 240 (or upper stage 230) andcorresponding to the lift pin 710. Therefore, substantially nointerference may be made between protection sheet 860 and thetransmission of the suction force through the holes 242 a (or 232 a) andthe operation of the lift pin 710 through the lower stage 240.

[0129] In one aspect of the present invention, the protection sheet 860may include a plurality of sheets formed to cover the surface of thelower stage 240 (or upper stage 230), wherein the plurality of sheetsare connected to each other. Accordingly, a first end of the protectionsheet 860 may be wound around the first reel 851 and a second end of theprotection sheet 860 may be wound around the second reel 852.

[0130] The portion of the protection sheet 860 wound around the firstreel 851 may be provided as an unused protection sheet 860 for useduring future substrate bonding processes, while the portion of theprotection sheet 860 wound around the second reel 852 may be provided asa used protection sheet 860 that may be removed from the substratebonding device after substrate bonding processes have been performed.The portion of the protection sheet 860 arranged over the surface of thestage may be provided as a working protection sheet 860 to be usedduring a present substrate bonding process.

[0131] Accordingly, unused portions of the protection sheet 860 woundaround the first reel 851 may be scrolled and arranged over a surface ofthe stage (i.e., a working region) and be used during a substratebonding process. After the substrate bonding process has been performed,the used working protection sheet 860 may be scrolled from the workingregion to the second reel 852, where it may be subsequently discarded.In one aspect of the present invention, the first and second reels 851and 852 may be arranged elevationally lower (or higher) than the surfaceof the lower stage 240 (or the upper stage 230) such that the surface ofthe stage is uniformly and smoothly covered (e.g., such that the portionof the protection sheet 860 is substantially flat over the surface ofthe stage).

[0132] According to the principles of the present invention, tensionadjusting jigs 880 may be provided adjacent the first and second reels851 and 852. In one aspect of the present invention, the tensionadjusting jigs 880 may be arranged between each of the reels and thecorresponding stage. In another aspect of the present invention, thetension adjusting jigs 880 may be rotatably mounted, mounted vertically(e.g., moveable in up and down directions) with respect to theprotection sheet 860, or mounted horizontally (e.g., moveable in leftand right directions) with respect to the protection sheet 860 formaintaining the protection sheet 860 in the working region substantiallyflat.

[0133] According to the principles of the present invention, the tensionadjusting jigs 880 may be provided with actuators, step motors, or thelike, for raising or lowering the tension adjusting jigs 880. In oneaspect of the present invention, the tension adjusting jigs 880 mayaccurately position the openings in the protection sheets 860 incorrespondence to the positions of the holes 242 a in the lower stage240 and to the position of the lift pin 710 such that operation of thesubstrate bonding device may proceed while maintaining the protectionsheet 860 in the working region substantially flat.

[0134] According to the principles of the present invention, therotating part 870 may rotate the first and second reels 851 and 852 andmay be provided to the second reel 852 only, the first reel 851 only, orboth the first and second reels 851 and 852.

[0135] A process for preventing the accumulation of foreign material onthe stages using the substrate bonding device of the fourth aspect ofthe present invention will now be described in greater detail below.

[0136] Referring to FIG. 24, and prior to bonding the substrates, therotating part 870 may be activated to rotate the second reel 852,wherein the protection sheet 860 wound around the first reel 851 may bescrolled over the surface of the lower stage 240. Accordingly, thepositions of the openings in the protection sheet 860 within the workingregion substantially correspond with positions of the holes 242 a in thesurface of the lower stage 240 and with a position of the lift pin 710.Such correspondence between the openings in the protection sheet 860 andthe other structures in the substrate bonding device may be controlledby, for example, controlling an amount of rotation of the second reel852.

[0137] Referring to FIGS. 25 and 26, the first substrate 110 may beloaded by the loader 910 and secured by the upper stage 230 followed bythe loading and securing of the second substrate 120 to the lower stage240. While the protection sheet 860 is arranged between the lower stage240 and the second substrate 120, the second substrate 120 may besecured to the top surface of the lower stage 240 because the protectionsheet 860 is formed of a material capable of transmitting anelectrostatic charge and the holes 242 a in the lower stage 240 areexposed by the holes in the protection sheet 860.

[0138] Next, referring to FIGS. 27 to 29, the substrates, secured totheir respective stages, may be bonded according to, for example, thesubstrate bonding process described above with respect to the firstaspect of the present invention. After the bonding, the bondedsubstrates may be unloaded from the substrate bonding device and theprocess described above may be repeated.

[0139] During the substrate bonding process described above, acontroller (not shown) for controlling the substrate bonding device maycontrol the number of times the protection sheet 860 has been scrolledfrom the first reel 851 to the working region. In one aspect of thepresent invention, the controller may scroll the protection sheet 860after a predetermined number of substrates have been bonded. In anotheraspect of the present invention, the protection sheet 860 may bescrolled according to a predetermined time interval, wherein an amountof time is measured and wherein the protection sheet 860 is scrolledprior to a substrate bonding process if the amount of time measuredexceeds the predetermined time interval.

[0140] Referring to FIG. 30, the protection sheet 860 may be scrolled bycontrolling the rotating part 870 to rotate the second reel 852 in apredetermined direction wherein the used protection sheet in the workingregion is scrolled and wound around the second reel 852 and an unusedprotection sheet 860 on the first reel part 851 is scrolled over thelower stage 240, to substantially cover the top surface of the lowerstage 240. In order to maintain the protection sheet 860 in the workingregion over the surface of the stage substantially flat, the tensionadjusting jigs 880 are rotated (or raised/lowered, moved in lateraldirections, etc.) when an unused protection sheet 860 is scrolled tocompletely cover the surface of the stage by the rotation of the reels851 and 852.

[0141] Accordingly, because positions of the openings in the protectionsheet 860 substantially correspond to positions of the holes 242 a andthe lift pin 710, a continuous fabrication process may be made possiblewhile the generation of defects caused by foreign material may besubstantially prevented.

[0142] It will be readily appreciated that the aforementioned principlesof the first to fourth aspects of the present invention may be combinedin substantially any manner required or may be used individually. Forexample, and with reference to FIG. 32, the gas spraying means and theionizer of the third aspect may be applied to the substrate bondingdevice of the second aspect, wherein the spraying means and the ionizermay be mounted to the upper chamber unit proximate the first and secondopenings 410 and 420, formed in the case 400. Moreover, and withreference to FIG. 33, the first and second reels 851 and 852, theprotection sheet 860, and the rotating part 870 of the fourth aspect maybe applied to the substrate bonding device of the second aspect.Furthermore, and with reference to FIG. 34, the spraying means and theionizer of the third aspect, and the reels 851 and 852, the protectionsheet 860, and the rotating part 870 of the fourth aspect may be appliedto the substrate bonding device of the second aspect. Still further, andwith reference to FIG. 35, the reels 851 and 852, the protection sheet860, and the rotating part 870 of the fourth aspect may be applied tothe substrate bonding device of the third aspect, and the like.

[0143] As has been described in accordance with the principles of thepresent invention, the substrate bonding device facilitating thefabrication of LCD devices formed via a liquid crystal dispensing methodis advantageous the overall size of the substrate bonding device may bereduced compared to related art substrate bonding devices because thesubstrate bonding device of the present invention is not provided withfunctionality to coat sealant material or dispense liquid crystalmaterial onto substrates. Accordingly, the substrate bonding deviceprovides a simplified design and saves space. Moreover, the volume ofthe interior space defined by the upper and lower chamber units may beminimized to thereby reduce the amount of time required to evacuate theinterior space. By reducing the evacuation time, the amount of timerequired to fabricate an LCD device may be reduced. Moreover, asimplified structure may be obtained by using the plurality of rotatablecams to align the substrates by adjusting a position of the lowerchamber unit.

[0144] Further, the second to fourth aspects of the present inventionsubstantially protect the space between the chamber units against fromexternal environment via the case. Accordingly, the introduction offoreign material may be substantially prevented, thereby preventing thegeneration of defects with LCD devices.

[0145] Moreover, as the substrate bonding device of the second aspect ofthe present invention may permit loading and unloading of the substratethrough opposite sides of the substrate bonding device, and LCDs may bemanufactured according to an in-line process. Accordingly a series ofprocesses (e.g., loading and unloading substrates) may be carried outsubstantially simultaneously to provide a substantially continuousfabrication process and shortening an overall amount of time required tofabricate the LCDs.

[0146] Further, the substrate bonding device of the third aspect of thepresent invention may substantially prevent the introduction of foreignmaterial into using a continuous spray of gas, separating an interiorspace between the chamber units from an external environment. In oneaspect of the present invention, the spray of gas may substantiallyremove foreign material from loader and from the substrates during theloading of the substrates. In another aspect of the present invention,the sprayed gas may include ions and may be directed proximate thesubstrates to substantially prevent the generation of static electricitywhen the stages secure the substrates.

[0147] Lastly, the substrate bonding device of the fourth aspect of thepresent invention may substantially prevent the accumulation ofmicron-sized particles onto the stages, thereby preventing thegeneration of defects within the LCD caused by the micron-sizedparticles.

[0148] It will be apparent to those skilled in the art that variousmodifications and variation can be made in the present invention withoutdeparting from the spirit or scope of the invention. Thus, it isintended that the present invention cover the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

What is claimed is:
 1. A substrate bonding device for fabricating aliquid crystal display (LCD) panel, comprising: a base frame: a lowerchamber unit mounted to the base frame, wherein the lower chamber unitdefines a lower interior space and includes an upper surface; an upperchamber unit arranged over the lower chamber unit, wherein the upperchamber unit defines an upper interior space, includes a lower surface,and is joinable to the lower chamber unit; chamber moving means forraising and lowering the upper chamber unit; an upper stage arrangedwithin the upper interior space for securing a first substrate; a lowerstage arranged within the lower interior space for securing a secondsubstrate; alignment cameras provided to at least one of the upper andlower chamber units for verifying an alignment state of a pluralityalignment marks formed on the first and second substrates; and alignmentmeans arranged at side portions of the lower chamber unit for adjustingan alignment between the first and second substrates.
 2. The substratebonding device as claimed in claim 1, wherein the upper chamber unitincludes: an upper base exposed to an external environment; and an upperchamber plate attached to the lower surface at a periphery of the upperbase.
 3. The device as claimed in claim 2, wherein the upper chamberplate is provided as a rectangular rim defining the upper interior spacewithin which the upper stage is arranged.
 4. The device as claimed inclaim 3, wherein the upper stage is fixed to the upper base.
 5. Thesubstrate bonding device as claimed in claim 1, wherein the lowerchamber unit includes: a lower base fixed to the base frame; and a lowerchamber plate arranged above the upper surface at a periphery of thelower base.
 6. The device as claimed in claim 5, wherein the lowerchamber plate is provided as a rectangular rim defining the lowerinterior space within which the lower stage is arranged.
 7. The deviceas claimed in claim 5, wherein the lower chamber plate is moveable inlateral directions with respect to the lower base.
 8. The device asclaimed in claim 5, wherein the lower stage is fixed to the lower base.9. The substrate bonding device as claimed in claim 1, wherein thealignment means includes: a plurality of cams rotatably provided toselectively contact and push peripheral portions of the lower chamberplate; a plurality of shafts connected to corresponding ones of theplurality of cams; and a plurality of motors fixed to the lower base andconnected to corresponding ones of the plurality of cams for rotatingthe plurality of cams via corresponding ones of the plurality of shafts.10. The substrate bonding device as claimed in claim 9, wherein each ofthe plurality of shafts are eccentrically connected to correspondingones of the plurality cams.
 11. The substrate bonding device as claimedin claim 9, wherein each of the plurality of motors include a stepmotor.
 12. The substrate bonding device as claimed in claim 9, whereinthe lower chamber unit includes a first pair of opposing sides and asecond pair of opposing sides, wherein a length of the first pair ofopposing sides is greater than a length of the second pair of opposingsides; two cams are arranged proximate each side of the first pair ofopposing sides; and one cam is arranged proximate each side of thesecond pair of opposing sides.
 13. The substrate bonding device asclaimed in claim 12, wherein the cams arranged proximate each side ofthe second pair of opposing sides are arranged substantially in themiddle of each side of the second pair of opposing sides.
 14. Thesubstrate bonding device as claimed in claim 12, wherein the camsarranged proximate each side of the first pair of opposing sides arearranged at side portions of each side of the first pair of opposingsides.
 15. The substrate bonding device as claimed in claim 12, whereina distance between oppositely arranged ones of cams remainssubstantially constant upon being rotated.
 16. The substrate bondingdevice as claimed in claim 1, further comprising interlocking meansprovided to the chamber units for coupling the upper chamber unit to thelower chamber unit.
 17. The substrate bonding device as claimed in claim16, wherein the interlocking means includes: a plurality of holes in theupper surface; a plurality of moveable shafts each having a first endand a second end; and a plurality of linear actuators fixed to the upperchamber unit and to the first ends of the plurality of moveable shaftsfor projecting the second ends of the plurality of the movable shaftsinto a corresponding one of the plurality of holes.
 18. The substratebonding device as claimed in claim 1, wherein the chamber moving meansincludes: a driving motor fixed to the base frame; a driving shaftcoupled to the driving motor; a connecting part connected to the drivingshaft; a jack part connected to the upper chamber unit; and a connectingshaft having one end connected to the upper chamber unit, and the otherend connected to receive a driving force from the driving shaft.
 19. Thesubstrate bonding device as claimed in claim 1, further comprising acase for enclosing the upper and lower chamber units.
 20. The substratebonding device as claimed in claim 19, wherein a side portion of thecase includes a first opening for loading substrates into the substratebonding device.
 21. The substrate bonding device as claimed in claim 19,wherein a side portion of the case includes a second opening forunloading substrates into the substrate bonding device.
 22. Thesubstrate bonding device as claimed in claim 1, further comprising:spraying means arranged at side portions of one of the upper and lowerchamber units for spraying gas toward sides of the other one of theupper and lower chamber units; blowing means for blowing the gas throughthe spraying means; and a first flow tube having a first end incommunication with the spraying means and a second end in communicationwith the blowing means.
 23. The substrate bonding device as claimed inclaim 22, wherein the spraying means includes a second flow tubearranged at side portions of the upper chamber unit, wherein a pluralityof spraying holes are arranged at a bottom portion of the second flowtube.
 24. The substrate bonding device as claimed in claim 23, whereinthe spraying means further includes an ionizer for emitting ions. 25.The substrate bonding device as claimed in claim 24, wherein the ionizerincludes an ion generating tip fitted in front of the plurality ofspraying holes in the second flow tube.
 26. The substrate bonding deviceas claimed in claim 22, further comprising an ionizer arranged proximateside portions of one of the upper and lower chamber units for emittingions toward side portions of the other one of the upper and lowerchamber units.
 27. The substrate bonding device as claimed in claim 26,wherein the ionizer includes: a flow tube arranged at side portions ofthe upper chamber unit, wherein the flow tube includes a plurality ofspraying holes facing toward the upper and lower stages, wherein gas isflowable through the plurality of spraying holes; and an ion generatingtip arranged proximate a front portion of each of the plurality ofspraying holes.
 28. The substrate bonding device as claimed in claim 27,wherein the gas includes nitrogen gas.
 29. The substrate bonding deviceas claimed in claim 27, wherein foreign material between the upper andlower chamber units is removable by the gas.
 30. The substrate bondingdevice as claimed in claim 1, further comprising a sealing meansprovided to at least one of the upper and lower surfaces for sealing aninterior space surrounding the first and second substrates, wherein thesealed interior space is definable by joined ones of the upper and lowerchamber units.
 31. The substrate bonding device as claimed in claim 30,wherein the sealing means includes an O-ring fitted along the uppersurface.
 32. The substrate bonding device as claimed in claim 1, furthercomprising: first and second reels arranged at opposite side portions ofat least one of the upper and lower stages; a protection sheet forcovering a surface of at least one stage, wherein the protection sheetis scrollable by the first and second reels; and a rotating part forrotating the first and second reels.
 33. The substrate bonding device asclaimed in claim 32, wherein at least one of the upper and lower stagesincludes an electrostatic chuck for applying an electrostatic charge tosecure a corresponding one of the first and second substrates.
 34. Thesubstrate bonding device as claimed in claim 33, wherein theelectrostatic chuck includes polyimide.
 35. The substrate bonding deviceas claimed in claim 33, wherein the electrostatic chuck includes aplurality of holes for transmitting a suction force to secure thecorresponding one of the first and second substrates.
 36. The substratebonding device as claimed in claim 33, wherein the electrostatic chargeappliable by the electrostatic chuck is transmittable by the protectionsheet.
 37. The substrate bonding device as claimed in claim 33, whereinthe protection sheet includes a plurality of holes.
 38. The substratebonding device as claimed in claim 37, wherein the plurality of holes inthe protection sheet are arrangeable to substantially correspond to aplurality of holes in the electrostatic chuck.
 39. The substrate bondingdevice as claimed in claim 32, wherein the first and second reels arearranged elevationally lower than the surface of the lower stage. 40.The substrate bonding device as claimed in claim 32, wherein the firstand second reels are arranged elevationally higher than the surface ofthe upper stage.
 41. The substrate bonding device as claimed in claim32, further comprising tension adjusting jigs arranged adjacent each ofthe first and second reels for maintaining the protection sheet to overthe surface of the at least one stage to be substantially flat.
 42. Thesubstrate bonding device as claimed in claim 41, wherein the tensionadjusting jigs are rotatably mounted.
 43. The substrate bonding deviceas claimed in claim 41, wherein the tension adjusting jigs are movablein vertical directions.
 44. The substrate bonding device as claimed inclaim 41, wherein the tension adjusting jigs are movable in lateraldirections.
 45. A substrate bonding device for fabricating a liquidcrystal display device (LCD), comprising: a base frame; a lower chamberunit mounted to the base frame, wherein the lower chamber unit defines alower interior space and includes an upper surface; an upper chamberunit arranged over the lower chamber unit, wherein the upper chamberunit defines an upper interior space, includes a lower surface, and isjoinable to the lower chamber unit; chamber moving means for raising andlowering the upper chamber unit; an upper stage arranged within theupper interior space for securing a first substrate; a lower stagearranged within the lower interior space for securing a secondsubstrate; a sealing means provided to at least one of the upper andlower surfaces for sealing an interior space surrounding the first andsecond substrates, wherein the sealed interior space is definable byjoined ones of the upper and lower chamber units; and a case forenclosing the upper and lower chamber units.
 46. The substrate bondingdevice as claimed in claim 45, wherein the case includes a transparentmaterial, wherein an inside of the substrate bonding device isobservable from outside the case through the transparent material. 47.The substrate bonding device as claimed in claim 45, wherein thetransparent material includes at least one window for enabling a portionof a substrate bonding process is observable from outside the casethrough the at least one window.
 48. The substrate bonding device asclaimed in claim 45, wherein an entirety of the case includestransparent material.
 49. The substrate bonding device as claimed inclaim 45, wherein the case includes a first opening for loadingsubstrates into the substrate bonding device.
 50. The substrate bondingdevice as claimed in claim 49, wherein the case includes a secondopening for unloading substrates from the substrate bonding device. 51.The substrate bonding device as claimed in claim 50, wherein the firstand second openings are formed in opposing surfaces of the case.
 52. Thesubstrate bonding device as claimed in claim 45, further comprising:spraying means arranged at side portions of one of the upper and lowerchamber units for spraying gas toward sides of the other one of theupper and lower chamber units; blowing means for blowing the gas throughthe spraying means; and a first flow tube having a first end incommunication with the spraying means and a second end in communicationwith the blowing means for transporting the gas from the blowing meansto the spraying means.
 53. The substrate bonding device as claimed inclaim 52, wherein the spraying means includes a second flow tubearranged at side portions of the upper chamber unit, wherein a pluralityof spraying holes are arranged at a bottom portion of the second flowtube.
 54. The substrate bonding device as claimed in claim 53, whereinthe spraying means further includes an ionizer for emitting ions. 55.The substrate bonding device as claimed in claim 54, wherein the ionizerincludes an ion generating tip fitted in front of the plurality ofspraying holes in the second flow tube.
 56. The substrate bonding deviceas claimed in claim 52, wherein a peripheral region of the other one ofthe upper and lower chamber units includes an outwardly sloped surface.57. The substrate bonding device as claimed in claim 56, wherein thesloped surface is curved.
 58. The substrate bonding device as claimed inclaim 52, further comprising an ionizer arranged proximate side portionsof one of the upper and lower chamber units for emitting ions towardside portions of the other one of the upper and lower chamber units. 59.The substrate bonding device as claimed in claim 58, wherein the ionizerincludes: a flow tube arranged at side portions of the upper chamberunit, wherein the flow tube includes a plurality of spraying holesfacing toward the upper and lower stages, wherein gas is flowablethrough the plurality of spraying holes; and an ion generating tiparranged proximate a front portion of each of the plurality of sprayingholes.
 60. The substrate bonding device as claimed in claim 59, whereinthe gas includes nitrogen gas.
 61. The substrate bonding device asclaimed in claim 59, wherein foreign material between the upper andlower chamber units is removable by the gas.
 62. The substrate bondingdevice as claimed in claim 45, further comprising: first and secondreels arranged at opposite side portions of at least one of the upperand lower stages; a protection sheet for covering a surface of at leastone stage, wherein the protection sheet is scrollable by the first andsecond reels; and a rotating part for rotating the first and secondreels.
 63. The substrate bonding device as claimed in claim 62, whereinat least one of the upper and lower stages includes an electrostaticchuck for applying an electrostatic charge to secure a corresponding oneof the first and second substrates.
 64. The substrate bonding device asclaimed in claim 63, wherein the electrostatic chuck includes apolyimide material.
 65. The substrate bonding device as claimed in claim63, wherein the electrostatic chuck includes a plurality of holes fortransmitting a suction force to secure the corresponding one of thefirst and second substrates.
 66. The substrate bonding device as claimedin claim 63, wherein the electrostatic charge appliable by theelectrostatic chuck is transmittable by the protection sheet.
 67. Thesubstrate bonding device as claimed in claim 62, wherein the protectionsheet includes a plurality of holes.
 68. The substrate bonding device asclaimed in claim 67, wherein the plurality of holes in the protectionsheet are arrangeable to substantially correspond to a plurality ofholes in the electrostatic chuck.
 69. The substrate bonding device asclaimed in claim 62, wherein the first and second reels are arrangedelevationally lower than the surface of the lower stage.
 70. Thesubstrate bonding device as claimed in claim 62, wherein the first andsecond reels are arranged elevationally higher than the surface of theupper stage.
 71. The substrate bonding device as claimed in claim 62,further comprising tension adjusting jigs arranged adjacent each of thefirst and second reels for maintaining the protection sheet to cover thesurface of the at least one stage to be substantially flat.
 72. Thesubstrate bonding device as claimed in claim 71, wherein the tensionadjusting jigs are rotatably mounted.
 73. The substrate bonding deviceas claimed in claim 71, wherein the tension adjusting jigs are movablein vertical directions.
 74. The substrate bonding device as claimed inclaim 71, wherein the tension adjusting jigs are movable in lateraldirections.
 75. A substrate bonding device for fabricating a liquidcrystal display device (LCD), comprising: a base frame; a lower chamberunit mounted to the base frame, wherein the lower chamber unit defines alower interior space and includes an upper surface; an upper chamberunit arranged over the lower chamber unit, wherein the upper chamberunit defines an upper interior space, includes a lower surface, and isjoinable to the lower chamber unit; chamber moving means for raising andlowering the upper chamber unit; an upper stage arranged within theupper interior space for securing a first substrate; a lower stagearranged within the lower interior space for securing a secondsubstrate; spraying means arranged along side portions of one of theupper and lower chamber units for spraying gas toward side portions ofthe other one of the upper and lower chamber units; blowing means forblowing the gas through the spraying means; and a first flow tube havinga first end in communication with the spraying means and a second end incommunication with the blowing means.
 76. The substrate bonding deviceas claimed in claim 75, wherein the spraying means includes a secondflow tube arranged at side portions of the upper chamber unit, wherein aplurality of spraying holes are arranged at a bottom portion of thesecond flow tube.
 77. The substrate bonding device as claimed in claim76, wherein the spraying means further includes an ionizer for emittingions.
 78. The substrate bonding device as claimed in claim 77, whereinthe ionizer includes an ion generating tip fitted in front of theplurality of spraying holes in the second flow tube.
 79. The substratebonding device as claimed in claim 75, wherein a peripheral region ofthe other one of the upper and lower chamber units includes an outwardlysloped surface.
 80. The substrate bonding device as claimed in claim 79,wherein the sloped surface is curved.
 81. The substrate bonding deviceas claimed in claim 75, further comprising an ionizer arranged proximateside portions of one of the upper and lower chamber units for emittingions toward side portions of the other one of the upper and lowerchamber units.
 82. The substrate bonding device as claimed in claim 81,wherein the ionizer includes: a flow tube arranged at side portions ofthe upper chamber unit, wherein the flow tube includes a plurality ofspraying holes facing toward the upper and lower stages, wherein gas isflowable through the plurality of spraying holes; and an ion generatingtip arranged proximate a front portion of each of the plurality ofspraying holes.
 83. The substrate bonding device as claimed in claim 82,wherein the gas includes nitrogen gas.
 84. The substrate bonding deviceas claimed in claim 82, wherein foreign material between the upper andlower chamber units is removable by the gas.
 85. The substrate bondingdevice as claimed in claim 75, further comprising: first and secondreels arranged at opposite side portions of at least one of the upperand lower stages; a protection sheet for covering a surface of at leastone stage, wherein the protection sheet is scrollable by the first andsecond reels; and a rotating part for rotating the first and secondreels.
 86. The substrate bonding device as claimed in claim 85, whereinat least one of the upper and lower stages includes an electrostaticchuck for applying an electrostatic charge to secure a corresponding oneof the first and second substrates.
 87. The substrate bonding device asclaimed in claim 86, wherein the electrostatic chuck includes apolyimide material.
 88. The substrate bonding device as claimed in claim86, wherein the electrostatic chuck includes a plurality of holes fortransmitting a suction force to secure the corresponding one of thefirst and second substrates.
 89. The substrate bonding device as claimedin claim 86, wherein the electrostatic charge appliable by theelectrostatic chuck is transmittable by the protection sheet.
 90. Thesubstrate bonding device as claimed in claim 86, wherein the protectionsheet includes a plurality of holes.
 91. The substrate bonding device asclaimed in claim 90, wherein the plurality of holes in the protectionsheet are arrangeable to substantially correspond to a plurality ofholes in the electrostatic chuck.
 92. The substrate bonding device asclaimed in claim 85, wherein the first and second reels are arrangedelevationally lower than the surface of the lower stage.
 93. Thesubstrate bonding device as claimed in claim 85, wherein the first andsecond reels are arranged elevationally higher than the surface of theupper stage.
 94. The substrate bonding device as claimed in claim 85,further comprising tension adjusting jigs arranged adjacent each of thefirst and second reels for maintaining the protection sheet to over thesurface of the at least one stage to be substantially flat.
 95. Thesubstrate bonding device as claimed in claim 94, wherein the tensionadjusting jigs are rotatably mounted.
 96. The substrate bonding deviceas claimed in claim 94, wherein the tension adjusting jigs are movablein vertical directions.
 97. The substrate bonding device as claimed inclaim 94, wherein the tension adjusting jigs are movable in lateraldirections.
 98. A substrate bonding device for fabricating a liquidcrystal display (LCD) device, comprising: an upper stage for securing afirst substrate of an LCD device; a lower stage for securing a secondsubstrate of the LCD device; first and second reels arranged at oppositeside portions of at least one of the upper and lower stages; aprotection sheet for covering a surface of at least one stage, whereinthe protection sheet is scrollable by the first and second reels; and arotating part for rotating the first and second reels.
 99. The substratebonding device as claimed in claim 98, wherein at least one of the upperand lower stages includes an electrostatic chuck for applying anelectrostatic charge to secure a corresponding one of the first andsecond substrates.
 100. The substrate bonding device as claimed in claim99, wherein the electrostatic chuck includes a polyimide material. 101.The substrate bonding device as claimed in claim 99, wherein theelectrostatic chuck includes a plurality of holes for transmitting asuction force to secure the corresponding one of the first and secondsubstrates.
 102. The substrate bonding device as claimed in claim 99,wherein the electrostatic charge appliable by the electrostatic chuck istransmittable by the protection sheet.
 103. The substrate bonding deviceas claimed in claim 99, wherein the protection sheet includes aplurality of holes.
 104. The substrate bonding device as claimed inclaim 103, wherein the plurality of holes in the protection sheet arearrangeable to substantially correspond to a plurality of holes in theelectrostatic chuck.
 105. The substrate bonding device as claimed inclaim 98, wherein the first and second reels are arranged elevationallylower than the surface of the lower stage.
 106. The substrate bondingdevice as claimed in claim 98, wherein the first and second reels arearranged elevationally higher than the surface of the upper stage. 107.The substrate bonding device as claimed in claim 98, further comprisingtension adjusting jigs arranged adjacent each of the first and secondreels for maintaining the protection sheet to over the surface of the atleast one stage to be substantially flat.
 108. The substrate bondingdevice as claimed in claim 107, wherein the tension adjusting jigs arerotatably mounted.
 109. The substrate bonding device as claimed in claim107, wherein the tension adjusting jigs are movable in verticaldirections.
 110. The substrate bonding device as claimed in claim 107,wherein the tension adjusting jigs are movable in lateral directions.111. A method of protecting stages of a substrate bonding device forfabricating a liquid crystal display (LCD) device, comprising: providinga stage for securing a substrate of an LCD device; providing first andsecond reels on opposite sides of the stage; arranging a protectionsheet over a surface of the stage, the protection sheet being scrollableover the surface of the stage; determining whether the protection sheetneeds to be replaced; and based on the determining, rotating first andsecond reels such that the protection sheet over the surface of thestage is wound around one of the first and second reels and a newprotection sheet is unwound from the other of the first and second reelsand is arranged over the surface of the stage.
 112. The method asclaimed in claim 111, wherein determining whether the protection sheetneeds to be replaced includes determining whether a number of substratesbonded using the protection sheet exceeds a predetermined number ofsubstrate bonding processes.
 113. The method as claimed in claim 111,wherein determining whether the protection sheet needs to be replacedincludes determining whether a predetermined amount of time has elapsed.